Computer and Mobile/Accessories/Accessories
Cooling paste
≥4.63W/m-k | Silver
Features
• Suitable to be applied to CPU, UPS, inverter, chipset and other PC components
• Low thermal resistance, high conductivity for heat transfer
This Nedis cooling paste is very heat conductive. It fills in all those microscopic imperfections on the heatsink and CPU/GPU that can trap air in them and cause a loss in the heatsink’s performance. The cooling paste ensures an outstanding heat conduction and dissipation. This allows you to run heavy programs without the motherboard getting overheated.
Packaging
Package contents
Cooling paste syringe
Application spatula
Retail package dimensions Giftbox with eurolock
| Width | Height | Length |
|---|---|---|
| 80 mm | 140 mm | 20 mm |
Logistic dimensions
| Packed per | Width | Height | Length | Weight |
|---|---|---|---|---|
| 1 | 115 mm | 185 mm | 20 mm | 26 g |
| 20 | 125 mm | 215 mm | 330 mm | 631 g |
| 40 | 250 mm | 200 mm | 355 mm | 1640 g |
Product specifications
| Width |
116 mm |
| Height |
22 mm |
| Depth |
18 mm |
| Weight |
8 g |
| Colour |
Silver |
| Type |
Paste |
| Moment beared temperature |
-50-300 °C |
| Specific gravity |
≥3.15 |
| Thermal conductivity |
≥4.63W/m-k |
| Thermal impedance |
≤0.0087 °C-in²/W |
| Thixotropic index |
280 ± 10 |
| Viscosity |
12500 |
| Number of Products in Package |
1 pcs |
| Operating temperature range |
-30 - 280 °C |
| SmartLife |
No |